Key Technical Features
- Current Carrying Capacity: Thicker copper reduces trace resistance, enabling higher current flow (e.g., 100A+ through 1mm-wide, 10 oz copper traces).
- Thermal Management: Improved heat dissipation via copper’s high thermal conductivity (401 W/m·K), ideal for power-dense components.
- Mechanical Rigidity: Enhanced structural strength for rugged environments (e.g., automotive vibration, industrial shocks).
Unmatched Electrical Performance
Low Resistance: Reduces power loss in high-current paths (e.g., 10 oz copper has 1/3 the resistance of 3 oz copper).
Stable Signal Integrity: Minimal voltage drop in power distribution networks, critical for automotive and industrial systems.
Superior Thermal Handling
Efficient Heat Dissipation: Copper layers act as heat sinks, preventing component overheating in power supplies and motor drives.
Thermal Cycle Resistance: Withstands repeated temperature fluctuations (-40°C to +125°C) without delamination.
Mechanical Durability
Heavy-Duty Construction: Reinforced through-hole plating and connector areas reduce mechanical stress failure.
Rugged Design: Suitable for harsh environments (e.g., military, aerospace, and heavy machinery).
Design Flexibility
Hybrid Layer Stacks: Combine thick copper power layers (e.g., 10 oz) with thin signal layers (e.g., 1 oz) for optimized performance.
Multi-Material Support: Available in FR-4, aluminum, ceramic (Al₂O₃/AlN), and flexible substrates.
Manufacturing Capabilities & Technical Specs
|
Feature |
Standard Capability |
Advanced Options |
|
Copper Thickness |
3–14 oz (inner/outer layers) |
15 oz (outer layer max) |
|
Layer Count |
1–24 layers |
Multilayer hybrid designs (power + signal) |
|
Material Options |
FR-4 (Tg 140°C/170°C), aluminum, ceramic, PTFE |
High-temperature materials (e.g., Rogers RT/duroid®) |
|
Trace Width/Spacing |
External: 9 mil/9 mil (4 oz) – 20 mil/32 mil (12 oz) |
Laser direct imaging for <5 mil precision |
|
Surface Finishes |
HASL (lead-free), ENIG, OSP, immersion silver |
Gold plating (hard gold for high-wear contacts) |
|
Thermal Management |
Thermal vias, copper infills |
Embedded heat sinks, liquid-cooling channels |
|
Testing |
Flying probe, AOI, Hi-Pot test |
Thermal impedance testing, X-ray inspection |
-
Electroplating
For layers up to 10 oz, using thick film copper cladding. -
Lamination
Bonding red copper foil (10–14 oz) with prepreg for ultra-thick layers. -
Solder Mask
Electrostatic spraying ensures uniform coverage on uneven copper surfaces.
Applications of Thick Copper PCBs
1. Automotive & EV/HEV
- High-Power Batteries: Battery management systems (BMS) with 8–12 oz copper for low-voltage, high-current paths.
- Motor Drives: Inverters and traction control modules requiring robust thermal dissipation.
- Ignition Systems: High-reliability PCBs for spark plug control in combustion engines.
2. Industrial Power Systems
- Power Supplies: 10–14 oz copper in switch-mode power supplies (SMPS) for data centers and renewable energy.
- Welding Equipment: PCBs withstand high transient currents and arc welding heat.
- Grid Infrastructure: Circuit breakers and overload relays with long-term thermal stability.
3. Aerospace & Defense
- Radar Systems: Heavy copper layers for high-power RF amplifiers.
- Military Vehicles: Rugged PCBs for weapons control and avionics, certified to MIL-PRF-55110.
- Satellite Power Modules: Ultra-thin (0.6mm) yet high-current designs for space applications.
4. Medical Equipment
- MRI/MRA Machines: Low-noise power distribution with 6–8 oz copper for electromagnetic compatibility (EMC).
- High-Power Lasers: PCBs for surgical equipment requiring precise thermal management.
Why Choose Our Thick Copper PCB Services?
Trusted by Global Leaders
Our solutions are used by clients in automotive (e.g., EV battery suppliers), industrial (e.g., solar inverter manufacturers), and medical sectors, with a proven track record in:
- High-Reliability Projects: PPAP Level 3 compliance for automotive clients.
- Extreme Environment Testing: Certified for vibration (MIL-STD-810G) and thermal shock (-40°C to +125°C).




