Cutting-edge electronic manufacturing services tailored for Tel Aviv's tech hubs, Haifa's research centers, and the Negev's industrial sectors.
Israel is globally renowned as the "Startup Nation," a dynamic powerhouse of technological innovation, research, and development. From the bustling high-tech corridors of Tel Aviv (Silicon Wadi) to the advanced engineering research centers in Haifa and the cybersecurity hubs in Beersheba, the demand for highly reliable, precision-engineered electronics is unprecedented. As a premier Complete PCB Solutions Factory & Manufacturer in Israel, we provide the foundational hardware manufacturing required to bring these groundbreaking digital and physical products to life. Our comprehensive suite of services spans from rapid prototyping for agile tech startups to high-volume mass production for established multinational corporations operating within the Israeli ecosystem.
The Israeli market is characterized by its fast-paced development cycles and uncompromising quality standards. Whether it is military-grade communications equipment, state-of-the-art medical devices, or next-generation agricultural technology (Agritech), the printed circuit boards (PCBs) at the heart of these systems must perform flawlessly under extreme conditions. We bridge the gap between innovative design and physical realization by offering end-to-end PCB manufacturing and assembly services. By leveraging AI-driven quality control, automated optical inspection (AOI), and advanced surface mount technology (SMT), we ensure that every board delivered meets the stringent IPC Class 2 and Class 3 standards frequently required by Israeli defense and medical sectors.
To support the complex geometries and high-density interconnects (HDI) demanded by modern Israeli electronics, we are equipped with industry-leading assembly and inspection equipment. Our highly trained and experienced engineering staff ensures that your projects are completed faster, with unparalleled high quality, ensuring a rapid time-to-market which is vital for startups in Tel Aviv and Jerusalem. Our capabilities in high-quality SMT PCB assembly services are designed to handle the most complex miniaturized components.
• Ball Grid Array (BGA)
• Ultra-Fine Ball Grid Array (uBGA)
• Quad Flat Pack No-Lead (QFN)
• Quad Flat Package (QFP)
• Small Outline Integrated Circuit (SOIC)
• Plastic Leaded Chip Carrier (PLCC)
• Package-On-Package (PoP)
• Small Chip Packages (pitch of 0.2 mm)
• Advanced AOI inspection
• 3D X-Ray Inspection for hidden solder joints
Defense and Aerospace: Israel's defense sector is one of the most advanced in the world, developing systems like the Iron Dome, unmanned aerial vehicles (UAVs), and advanced radar systems. These applications require rigid-flex PCBs, high-frequency materials (like Rogers), and components that can withstand the harsh thermal cycling of the Negev desert. Our complete PCB solutions provide the ruggedization and conformal coating necessary for mission-critical military hardware.
Medical Technology (MedTech): Haifa and Tel Aviv host hundreds of life-science and medical device startups. From non-invasive diagnostic wearables to complex surgical robots and ECG monitors, the medical industry demands zero-defect manufacturing. We provide strict ISO 13485 compliant assembly processes, ensuring that life-saving devices are manufactured with the highest degree of traceability and reliability.
Agritech and Smart Water Management: Given Israel's arid climate, the nation has pioneered smart irrigation, desalination, and precision agriculture. We manufacture the IoT sensor boards, solar inverter PCBs, and distributed power generation control systems that allow Israeli farmers to monitor soil moisture via satellite and power remote desert facilities efficiently.
Cybersecurity and AI Hardware: As a global leader in cybersecurity, Israeli companies are increasingly developing proprietary hardware firewalls, encrypted communication devices, and AI edge-computing modules. These require high-layer-count boards with Package-on-Package (PoP) technology to process massive amounts of data securely and swiftly. Our ultra-fine pitch assembly capabilities perfectly align with these high-tech requirements.
The trajectory of the PCB manufacturing industry in Israel is heavily influenced by the global push towards miniaturization and the integration of Artificial Intelligence. As devices become smaller yet more powerful, the demand for 01005 component placement and microvias has surged. Startups are no longer satisfied with standard FR4 boards; there is a massive shift towards High-Density Interconnect (HDI) boards, flexible circuits for wearable tech, and metal-core PCBs for high-power LED and automotive applications (especially with the rise of autonomous vehicle research in Israel).
Furthermore, supply chain resilience has become a paramount concern. Israeli tech firms are seeking complete PCB solution factories that offer turnkey services—from component sourcing and bare board fabrication to final SMT assembly and box-build. By consolidating the supply chain, companies reduce the risk of counterfeit components, lower their logistical overhead, and significantly accelerate their product development cycles. Our factory's immense capacity, capable of placing over 1.25 million chips per hour, ensures that we can scale seamlessly from a 10-piece prototype run to full-scale mass production without missing a beat.
Our state-of-the-art manufacturing floor is designed for maximum efficiency, precision, and scalability. Below is a detailed breakdown of our production lines, showcasing our high-speed placement machines, nitrogen furnaces, and advanced optical inspection systems that guarantee the quality of every Complete PCB Solution we deliver to the Israeli market.
| Line order | Equipment | Component package | PCB size range | Components packing type | CHIP(H) | ||
|---|---|---|---|---|---|---|---|
| MIN. | MAX. | MIN. | MAX. | ||||
| Line 1 | DESEN A5 + SINIC-TEK NOVA + CM602L+CM602L+ JT NS-1000II + AOI (JT JTA-518) | 0402 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 392 Tape (reel) 20 Tray | 142000 |
| Line 2 | DESEN Classic-1008 + SINIC-TEK 8080+ NPM-D3+NPM-D3+CM602 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + AOI (MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20 Tray | 210000 |
| Line 3 | DESEN Classic-1008 + SINIC-TEK 8080+ NPM-D3+CM602 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + AOI(MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 4 | DESEN A5 + SINIC-TEK 8080+NPM-D3A+NPM-D3A+CM602 + JTR-1000D-NF(10 temperature zone nitrogen furnace) + AOI(MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 5 | DESEN Classic-1008 + SINIC-TEK NOVA+NPM-D3A+NPM-D3A+CM602 + JTR-1000D-NF(10 temperature zone nitrogen furnace) + AOI (MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 6 | 1-track DESEN A5-BTB+2-track DESEN A5-BTB+SINIC-TEK NOVA-D+NPM-D3+NPM-D3+NPM-D3+NPM-TT2+JT NS-1000II+AOI (double track LI-3000DP) | 01005 | 120×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 290 Tape(reel) 20 Tray | 272000 |
| Total chips per hour | 1254000 | ||||||
Explore our diverse portfolio of PCB assemblies, powering everything from Jerusalem's medical innovations to Haifa's industrial automation.