Proving Reliability: How Burn-In and Stress Testing Validate Long-Term Performance
Understanding the Bathtub Curve
Electronic Components follow a predictable failure pattern known as the bathtub curve. Early life (infant mortality) shows higher failure rates that decrease rapidly as weak components fail. Useful life shows low, constant failure rates under normal conditions. End of life shows increasing failure rates due to wear-out mechanisms. Burn-in testing accelerates the infant mortality phase, causing weak components to fail in our facility rather than in your customers' hands.
Burn-In Testing Methods
We offer multiple burn-in approaches based on product requirements. Temperature-only burn-in operates assemblies at elevated temperatures (typically 50-85°C) without applied power—effective for some failure mechanisms but limited for others. Powered burn-in operates assemblies under normal or slightly stressed electrical conditions at elevated temperature—more effective as it stresses active components. Dynamic burn-in applies cycling signals and loads during exposure—most effective but requires custom test fixtures. Thermal cycling alternates between hot and cold extremes to stress solder joints and material interfaces.
Thermal Cycling and Thermal Shock
For products exposed to changing temperatures in service, thermal cycling is essential. Our chambers cycle assemblies between temperature extremes, with typical profiles ranging from -40°C to +85°C or more extreme as required. Ramp rates and dwell times are controlled based on product specifications and failure mechanisms of concern. Thermal shock—rapid transfer between hot and cold chambers—offers even more aggressive stress for high-reliability applications.
Environmental Stress Screening
Beyond pure temperature exposure, we offer comprehensive environmental stress screening. This may include temperature cycling combined with applied power, random vibration to simulate transportation and operational stress, humidity exposure to test corrosion resistance, and altitude or pressure testing for aerospace applications. The specific test profile is customized based on your product's expected service environment.
Monitoring During Burn-In
When specified, we provide monitoring during burn-in to detect failures as they occur. This may include continuous voltage and current monitoring, functional testing at temperature extremes, automated data logging of performance parameters, and fault detection and recording. Monitoring adds significant value by identifying not just that a failure occurred, but precisely when and under what conditions.
Post-Burn-In Verification
After burn-in completion, all assemblies receive final functional testing while still at temperature extremes in many cases, followed by thorough visual inspection for any physical changes (discoloration, component cracking, connector damage), and electrical retest at room temperature to confirm function. Assemblies that pass all steps are considered burn-in verified and ready for shipment.
Burn-in testing is an investment in your product's reputation. By identifying and eliminating early-life failures before shipment, we help you deliver assemblies that perform reliably from the first use through years of service.
Is your product destined for applications where early failure is unacceptable? Contact us to discuss how our burn-in and stress screening services can validate your product's long-term reliability.