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16-PCBA-Quality

Inspection & Testing

Inspection & Testing at STHL

As an ISO9001 certificated electronics assembly manufacturer, STHL Technology adheres to a thorough quality and process control. The tests and inspections include physical and visual inspections, open & short tests, AOI inspections, X-ray inspection, and In-Circuit tests. We also make ageing testing both for mother board and finished product. These PCBA inspection process ensure customers final product meets their design specifications, and also control the whole production lot to high non-defective ratio which reduce the entire lead time.

AOI Inspection 100_
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AOI Inspection 100%

AOI Inspection down to 0201 Package
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AOI Inspection down to 0201 Package

X-Ray Inspection
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X-Ray Inspection

PCBA SMT Prototype Inspection
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PCBA SMT Prototype Inspection

IQC Instructions
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IQC Instructions

X-Ray Inspection for BGA
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X-Ray Inspection for BGA

8-12 Hours Ageing Test
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8-12 Hours Ageing Test

Test Fixture Designed as Per Project
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Test Fixture Designed as Per Project

12-24 Hours Ageing Test
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12-24 Hours Ageing Test

Comprehensive Testing Services

STHL offers customizable testing solutions to cater to specific client needs and product requirements.
Here's a typical range of testing services provided:
Printing Solder Paste Test

Printing Solder Paste Test

AOI

Automatic Optical Inspection (AOI)

In-Circuit Testing (ICT)

In-Circuit Testing (ICT)

X-Ray Inspection for BGA (Ball Grid Array) components

X-Ray Inspection for BGA (Ball Grid Array) components

Functional Testing

Functional Testing

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test

Solder Paste Inspection (SPI) 

To ensure the highest quality, we integrate Solder Paste Inspection (SPI) into every production run. This process utilizes 3D scanning to validate solder paste volume and alignment, preventing soldering defects at the source.

AOI

100% AOI Inspection

Every PCB undergoes an Automated Optical Inspection to detect missing components, damage, deviations, incorrect assembly, and more.

In-Circuit Testing

In-Circuit Testing (ICT)

This automated testing equipment thoroughly evaluates circuit boards, including component values, circuit connections, and board layout. It identifies anomalies and prompts corrective actions, ensuring consistent quality and minimizing defects.

X-Ray Inspection for BGA (Ball Grid Array) components

X-Ray Inspection

This high-resolution technology provides an in-depth examination of BGA assemblies, ensuring proper component placement and identifying potential defects like fake assembly, missing solder balls, and encapsulation issues. It also helps detect misalignment, solder bridges, and other manufacturing flaws.

Functional Testing

Function Testing

Every PCB undergoes 100% functional testing, similar to In-Circuit Testing, to guarantee optimal performance.