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In the domain of safety and security, contract manufacturing extends beyond standard assembly to incorporate integration of sensor technologies, AI-powered control modules, and wireless communication units. Enhanced SMT (Surface Mount Technology) PCB assembly methods enable compact and robust electronics to operate in harsh or sensitive environments.
Examples of application include:
– Ball Grid Array (BGA)
– Ultra-Fine Ball Grid Array (uBGA)
– Quad Flat Pack No-Lead (QFN)
– Quad Flat Package (QFP)
– Small Outline Integrated Circuit (SOIC)
– Plastic Leaded Chip Carrier (PLCC)
– Package-On-Package (PoP)
– Small Chip Packages (pitch of 0.2 mm)
– AOI inspection
– X-Ray Inspection
| Line order | Equipment | Component package | PCB size range | Components packing type | CHIP(H) | ||
|---|---|---|---|---|---|---|---|
| MIN. | MAX. | MIN. | MAX. | ||||
| Line 1 | DESEN A5 + SINIC-TEK NOVA + CM602L+CM602L+ JT NS-1000II + AOI (JT JTA-518) | 0402 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 392 Tape (reel) 20 Tray | 142000 |
| Line 2 | DESEN Classic-1008 + SINIC-TEK 8080+ NPM-D3+NPM-D3+CM602 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + AOI (MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20 Tray | 210000 |
| Line 3 | DESEN Classic-1008 + SINIC-TEK 8080+ NPM-D3+CM602 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + AOI（MAKER-RAY AIS401B-D） | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 4 | DESEN A5 + SINIC-TEK 8080+NPM-D3A+NPM-D3A+CM602 + JTR-1000D-NF(10 temperature zone nitrogen furnace) + AOI(MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 5 | DESEN Classic-1008 + SINIC-TEK NOVA+NPM-D3A+NPM-D3A+CM602 + JTR-1000D-NF(10 temperature zone nitrogen furnace) + AOI (MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 6 | 1-track DESEN A5-BTB+2-track DESEN A5-BTB+SINIC-TEK NOVA-D+NPM-D3+NPM-D3+NPM-D3+NPM-TT2+JT NS-1000II+AOI (double track LI-3000DP) | 01005 | 120×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 290 Tape(reel) 20 Tray | 272000 |
| Total chips per hour | 1254000 | ||||||
The Electronic Contract Manufacturing sector for safety and security is poised for transformative growth fueled by advances in AI, edge computing, and cybersecurity integration. Leading ECM providers are investing heavily in:
The convergence of safety system innovation with contract manufacturing expertise is enabling providers to deliver smarter, safer environments — from smart cities and industrial parks to residential and commercial buildings.
