– Ball Grid Array (BGA)
– Ultra-Fine Ball Grid Array (uBGA)
– Quad Flat Pack No-Lead (QFN)
– Quad Flat Package (QFP)
– Small Outline Integrated Circuit (SOIC)
– Plastic Leaded Chip Carrier (PLCC)
– Package-On-Package (PoP)
– Small Chip Packages (pitch of 0.2 mm)
– AOI inspection
– X-Ray Inspection
STHL SMT Equipment and Capability
| Line order | Equipment | Component package | PCB size range | Components packing type | CHIP(H) | ||
| MIN. | MAX. | MIN. | MAX. | ||||
| Line 1 | DESEN A5 + SINIC-TEK NOVA + CM602L+CM602L+ JT NS-1000II + AOI (JT JTA-518) | 0402 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 392 Tape (reel) 20 Tray | 142000 |
| Line 2 | DESEN Classic-1008 + SINIC-TEK 8080+ NPM-D3+NPM-D3+CM602 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + AOI (MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20 Tray | 210000 |
| Line 3 | DESEN Classic-1008 + SINIC-TEK 8080+ NPM-D3+CM602 + JT JTR-1203D-N(12 temperature zone nitrogen furnace) + AOI(MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 4 | DESEN A5 + SINIC-TEK 8080+NPM-D3A+NPM-D3A+CM602 + JTR-1000D-NF(10 temperature zone nitrogen furnace) + AOI(MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 5 | DESEN Classic-1008 + SINIC-TEK NOVA+NPM-D3A+NPM-D3A+CM602 + JTR-1000D-NF(10 temperature zone nitrogen furnace) + AOI (MAKER-RAY AIS401B-D) | 01005 | 100×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 256 Tape(reel) 20Tray | 210000 |
| Line 6 | 1-track DESEN A5-BTB+2-track DESEN A5-BTB+SINIC-TEK NOVA-D+NPM-D3+NPM-D3+NPM-D3+NPM-TT2+JT NS-1000II+AOI (double track LI-3000DP) | 01005 | 120×90mm Pitch=0.2mm | 50×50mm | 400×290mm | 290 Tape(reel) 20 Tray | 272000 |
| Total chips per hour | 1254000 | ||||||




